Title :
Hierarchical conjugate gradient method applied to MoM analysis of electrically large structures
Author :
Kolundzija, Branko ; Sumic, Drazen
Author_Institution :
Dept. of Electr. Eng., Belgrade Univ., Serbia
Abstract :
Arbitrary metallic and dielectric/magnetic structures can be analyzed by applying the method of moments (MoM) to the surface integral equations (SIEs). Such a structure is usually modeled by triangular or quadrilateral patches. Hierarchical higher order basis functions defined on those patches allow very efficient analysis. However, even for such sophisticated current expansions, the number of unknowns for electrically large structures can be so high that the analysis based on the direct solution of the matrix equation (e.g., LU decomposition) becomes inefficient. The paper presents the hierarchical conjugate gradient method (HCGM), a simple but effective modification of the standard CGM for higher order systems. In addition, we investigate the influence of the orthogonality of basis functions and the normalization of the basis functions in respect to their Euclidean norms on the behavior of iterative solvers. Significant reduction in analysis time for higher order problems is achieved. Conclusions based on the numerical results are given.
Keywords :
computational electromagnetics; conducting bodies; conjugate gradient methods; dielectric bodies; electric current; electromagnetic wave scattering; integral equations; method of moments; Euclidean norms; LU decomposition; MoM analysis; dielectric structures; electrically large structures; hierarchical conjugate gradient method; hierarchical higher order basis functions; iterative solvers; magnetic structures; matrix equation; metallic sphere scatterer; metallic structures; method of moments; surface integral equations; Acceleration; Equations; Gradient methods; Iterative methods; Message-oriented middleware; Moment methods; Performance analysis; Polynomials; Sun; User-generated content;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN :
0-7803-8302-8
DOI :
10.1109/APS.2004.1330341