Title :
Fast window accelerated SDA evaluation for the propagation of multi-layer interconnect
Author :
Yu, Tiejun ; Yu, Baochu ; Cai, Wei
Author_Institution :
Sigrity Inc., Santa Clara, CA, USA
Abstract :
The spectral domain approach (SDA) is presented here for the solution of complex propagation constant and current distributions of on-chip multi-layer interconnect lines. As SDA is a full wave solution and is usually computing-expensive, a novel wavelet window-based technique is used to accelerate the SDA computation. The proposed algorithm´s efficiency and accuracy are discussed and demonstrated.
Keywords :
current distribution; electromagnetic wave propagation; integrated circuit design; integrated circuit interconnections; printed circuits; spectral-domain analysis; complex propagation constant; current distributions; multi-layer interconnect propagation; on-chip interconnect lines; spectral domain approach; wavelet window-based technique; window accelerated SDA evaluation; Acceleration; Civil engineering; Current distribution; Dielectric substrates; Frequency; H infinity control; Propagation constant; Strips; Surface resistance; Transmission line matrix methods;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN :
0-7803-8302-8
DOI :
10.1109/APS.2004.1330393
