Integrable miniaturized folded antennas for RFID applications

Author

Li, R.L. ; DeJean, G. ; Tentzeris, M.M. ; Laskar, J.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

2

fYear

2004

fDate

20-25 June 2004

Firstpage

1431

Abstract

Low cost, low profile, and miniaturized size are the most critical factors needed to consider in the design of antennas for RFID applications. We present two simple folded structures based on integrable packaging processes. The first one is a 3D folded patch implemented on LTCC multilayer technology while the second is a printed folded strip antenna fabricated on RT/Duroid board. The dimensions of the folded patch antenna are approximately λ₀/16×λ₀/16 and the maximum length of the folded strip is less than λ₀/10. Both antennas have a peak gain of 0 dBi.

Keywords

antenna radiation patterns; electronics packaging; microstrip antennas; 3D folded patch antenna; LTCC multilayer technology; RFID antennas; RT/Duroid board; folded structures; integrable miniaturized folded antennas; integrable packaging processes; inverted-F antenna; printed folded strip antenna; radiation pattern; Application software; Costs; Design engineering; Dielectric substrates; Microstrip antennas; Nonhomogeneous media; Patch antennas; Printed circuits; Radiofrequency identification; Resonant frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2004. IEEE

Print_ISBN

0-7803-8302-8

Type

conf

DOI

10.1109/APS.2004.1330456

Filename

1330456