Title :
Integrable miniaturized folded antennas for RFID applications
Author :
Li, R.L. ; DeJean, G. ; Tentzeris, M.M. ; Laskar, J.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Low cost, low profile, and miniaturized size are the most critical factors needed to consider in the design of antennas for RFID applications. We present two simple folded structures based on integrable packaging processes. The first one is a 3D folded patch implemented on LTCC multilayer technology while the second is a printed folded strip antenna fabricated on RT/Duroid board. The dimensions of the folded patch antenna are approximately λ0/16×λ0/16 and the maximum length of the folded strip is less than λ0/10. Both antennas have a peak gain of 0 dBi.
Keywords :
antenna radiation patterns; electronics packaging; microstrip antennas; 3D folded patch antenna; LTCC multilayer technology; RFID antennas; RT/Duroid board; folded structures; integrable miniaturized folded antennas; integrable packaging processes; inverted-F antenna; printed folded strip antenna; radiation pattern; Application software; Costs; Design engineering; Dielectric substrates; Microstrip antennas; Nonhomogeneous media; Patch antennas; Printed circuits; Radiofrequency identification; Resonant frequency;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN :
0-7803-8302-8
DOI :
10.1109/APS.2004.1330456
