Surface-based broadband electromagnetic-circuit simulation of lossy conducting structures in microelectronic circuits

The rapid growth in the switching speed and packing density of integrated digital, analog, RF, and microwave circuits has increased the importance of accurate electromagnetic (EM) modeling. A seamless broadband method is presented to model the EM behaviour of conducting structures in microelectronic circuits through a unified matrix. The EM modeling, as well as the coupling scheme, is explained. Results are presented to validate the proposed broadband technique against an existing commercial solver. Further post-processing is performed in order to determine the volumetric current flow inside the conductor using a surface only formulation, and comparisons to skin effect models is also demonstrated. Continuing work includes low-frequency stabilization and fast multilevel solvers based on QR methods.