Mixed electromagnetic and electrical circuit simulation for RFIC characterization

Author

Cendes, Z. ; Yen, Albert

Author_Institution

Ansoft Corp., Pittsburgh, PA, USA

Volume

3

fYear

2004

fDate

20-25 June 2004

Firstpage

3289

Abstract

IC foundries such as UMC have adopted a combined electromagnetic field-electrical circuit simulation approach for modeling on-chip passive interconnect structures. This approach provides an accurate method for characterizing the frequency response of 3D structures such as spiral inductors. Using 3D electromagnetic field simulation provides an accurate characterization of the frequency response of the spiral. The frequency response of the S-parameters is evaluated as a reduced order circuit model that is combined with SPICE files to provide electromagnetically accurate circuit behavior used in chip level simulations.

Keywords

S-parameters; SPICE; circuit simulation; computational electromagnetics; electromagnetic fields; frequency response; inductors; radiofrequency integrated circuits; 3D electromagnetic field simulation; RFIC characterization; S-parameters; SPICE files; UMC; chip level simulations; electrical circuit simulation; frequency response; on-chip passive interconnect structures; reduced order circuit model; spiral inductors; Circuit simulation; Electromagnetic fields; Electromagnetic modeling; Foundries; Frequency response; Inductors; Integrated circuit interconnections; Integrated circuit modeling; Radiofrequency integrated circuits; Spirals;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2004. IEEE

Print_ISBN

0-7803-8302-8

Type

conf

DOI

10.1109/APS.2004.1332082

Filename

1332082