Title :
Miniaturized 90° hybrid circuit using quasi-distributed TFMS line
Author :
Tanaka, T. ; Nishikawa, K. ; Aikawa, M.
Author_Institution :
Dept. of Electr. & Electron. Eng., Saga Univ., Japan
Abstract :
In this paper, very miniaturized 90° hybrid circuit using quasi-distributed TFMS line is described. In a planar formed conventional MMIC\´s, the passive circuits such as 90° branch-line hybrid has occupied a large chip area. Therefore, it is strongly desired that the chip area is more miniaturized. For increasing integration level, the three-dimensional (3D) MMIC has been developed. In the 3D MMICs, meander-like lines are realized easily and many metal-insulator-metal (MIM) capacitors can be loaded on transmission lines. By the 3D MMIC topology, a transmission line composed of high impedance thin film microstrip (TFMS) lines and MIM capacitors are realized easily. This type TFMS transmission line is called "quasi-distributed thin film microstrip (QD-TFMS) line". A very small 90° branch-like hybrid using the QD-TFMS lines is realized. The fabricated 9° branch-like hybrid size is more than 80% smaller than that of conventional one compose of meander-like transmission lines in area.
Keywords :
MIM structures; MMIC; hybrid integrated circuits; microstrip circuits; thin film circuits; 3D MMIC; branch-like hybrid size; chip area; meander-like transmission lines; metal-insulator-metal capacitors; miniaturized hybrid circuit; passive circuits; quasidistributed TFMS line; thin film microstrip; transmission line; Capacitance; Distributed parameter circuits; Impedance; MIM capacitors; MMICs; Metal-insulator structures; Microstrip; Passive circuits; Transistors; Transmission lines;
Conference_Titel :
Microwave Symposium Digest, 2004 IEEE MTT-S International
Print_ISBN :
0-7803-8331-1
DOI :
10.1109/MWSYM.2004.1335886
