Global EM and thermal analysis of a 40 Gb/s all integrated optoelectronic transmitter module

Author

Thon, Benjamin ; Baillargeat, Dominique ; Verdeyme, Serge ; Lefèvre, René

Author_Institution

IRCOM - UMR CNRS, Limoges, France

Volume

1

fYear

2004

fDate

6-11 June 2004

Firstpage

409

Abstract

The main objective of this paper is to show how a global approach combining EM simulations, classical circuit analysis and thermal analysis can be useful to help the design of complex modules. The module under test is an all integrated 40 Gb/s optoelectronic transmitter which combines MUX-driver-EAM in a single module, developed within the framework of the ERMIONE French RNRT project. We first present a 3D EM analysis and a classical circuit one of a part of the transmitter module. Then a rigorous thermal study applying a 3D finite element method is used in order to understand the thermal behavior of the module components. Finally, the ERMIONE transmitter was presented.

Keywords

computational electromagnetics; finite element analysis; integrated circuit design; microwave integrated circuits; network analysis; optoelectronic devices; packaging; thermal analysis; 3D EM analysis; 3D finite element method; 40 Gbit/s; EM simulations; ERMIONE French RNRT project; ERMIONE transmitter; MUX-driver-EAM; classical circuit analysis; electromagnetic analysis; integrated optoelectronic transmitter; optoelectronic device; packaging; rigorous thermal study; thermal behavior; transmitter global EM analysis; transmitter module designing; transmitter thermal analysis; Bandwidth; Circuit analysis; Circuit simulation; Circuit testing; Finite element methods; Frequency; Integrated optoelectronics; Microwave circuits; Packaging; Transmitters;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2004 IEEE MTT-S International

ISSN

0149-645X

Print_ISBN

0-7803-8331-1

Type

conf

DOI

10.1109/MWSYM.2004.1335911

Filename

1335911