Title :
1-Watt Ku-band power amplifier MMICs using low-cost quad-flat plastic package
Author :
Bessemoulin, A. ; Parisot, M. ; Camiade, M.
Author_Institution :
United Monolithic Semicond., Orsay, France
Abstract :
This paper presents the performance of a 1-Watt Ku-band power amplifier MMIC in Quad Flat Plastic package (QFN) compatible with SMD assembly line. Due to the use of simple materials, it allows a significant cost reduction for RF module assembly. Depending on the QFN technology used (molded or air-cavity package), the packaged amplifier exhibits very high-gain ranging from 24- to 30 dB at Ku-band, with more than 1-Watt CW output power, under ultra-stable conditions. To the author´s knowledge, this is the first paper reporting the use of such package for power devices at this frequency.
Keywords :
MMIC power amplifiers; integrated circuit design; integrated circuit packaging; modules; plastic packaging; surface mount technology; 1 W; 24 to 30 dB; CW output power; Ku-band power amplifier; RF module assembly; air cavity QFN package; continuous wave output power; molded QFN package; power devices; quad flat plastic package; surface mount device assembly line; Assembly; Bonding; Costs; Frequency; High power amplifiers; MMICs; Microwave devices; Plastic packaging; Semiconductor device packaging; Thermal resistance;
Conference_Titel :
Microwave Symposium Digest, 2004 IEEE MTT-S International
Print_ISBN :
0-7803-8331-1
DOI :
10.1109/MWSYM.2004.1336015
