A 70+GHz BW package for multigigabit IC applications

Author

Choudhury, Debabani ; Foschaar, James ; Bowen, Ross ; Mokhtari, Mehran

Author_Institution

LLC, HRL Labs., Malibu, CA, USA

Volume

2

fYear

2004

fDate

6-11 June 2004

Firstpage

1209

Abstract

We have developed a ultra-wideband package technology for multiport ultra-high speed integrated circuit (IC) module applications. The cost-effective, compact, easy-to-assemble package can house any substrate-IC assembly that can be replaced without damaging the mm-wave connectors. A multi-layer substrate processing approach has been developed to achieve low-insertion loss and high-isolation signal lines as well as good thermal management. Careful design of this package suppresses cavity resonances and demonstrates an operating bandwidth of 70+GHz. DC-60+ performance has been demonstrated for a static frequency divider module using this packaging technology.

Keywords

III-V semiconductors; bipolar integrated circuits; frequency dividers; high-speed integrated circuits; indium compounds; integrated circuit design; integrated circuit packaging; modules; thermal management (packaging); 70 GHz; InP; Si; cavity resonances; high isolation signal; high-speed IC module; high-speed integrated circuits module; millimeter wave connectors; multigigabit IC applications; static frequency divider module; thermal management; ultra wideband package technology; Application specific integrated circuits; Assembly; Bandwidth; Connectors; Integrated circuit packaging; Integrated circuit technology; Resonance; Signal processing; Thermal management; Ultra wideband technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2004 IEEE MTT-S International

ISSN

0149-645X

Print_ISBN

0-7803-8331-1

Type

conf

DOI

10.1109/MWSYM.2004.1339205

Filename

1339205