• DocumentCode
    421090
  • Title

    Power estimation and thermal budgeting methodology for FPGAs

  • Author

    Lui, Henry Y. ; Lee, Chong H. ; Patel, Rakesh H.

  • Author_Institution
    Altera Corp., San Jose, CA, USA
  • fYear
    2004
  • fDate
    3-6 Oct. 2004
  • Firstpage
    711
  • Lastpage
    714
  • Abstract
    The method used for power estimation and thermal budgeting on an FPGA product line, fabricated using 90 nm technology, is described in this paper. It addresses the reasons why state-of-the-art processes create power concerns on FPGAs, and describes methodologies that provide more relevant power and junction temperature estimations. Finally it suggests what can be done to improve the power budget and to balance the trade-offs between power and performance.
  • Keywords
    circuit simulation; field programmable gate arrays; integrated circuit design; integrated circuit modelling; leakage currents; logic simulation; 90 nm; FPGA; junction temperature estimation; leakage power estimation; power budget; power estimation; power/performance trade-offs; thermal budgeting; thermal runaway; Circuit simulation; Costs; Data mining; Field programmable gate arrays; Frequency; Semiconductor device packaging; State estimation; Technological innovation; Temperature; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004
  • Print_ISBN
    0-7803-8495-4
  • Type

    conf

  • DOI
    10.1109/CICC.2004.1358928
  • Filename
    1358928