DocumentCode
421365
Title
Will the ASIC survive?
Author
Camposano, Raul
Author_Institution
Synopsys Inc., Mountain View, CA, USA
fYear
2004
fDate
7-11 Sept. 2004
Firstpage
5
Abstract
ASIC design starts have declined lately and many voices speak of fundamental changes as a result of increasing design costs, predicting even the extinction of ASIC design altogether. ASICs and ASSPs have been a formidable economic force, accounting for over one third of the semiconductor market. Standard cell based designs have also been the major consumer of EDA tools and design technology. However, raising NRE costs which stand at approximately $10 M to design an ASIC at the 130 nm technology node, cost of re-spins, lack of flexibility (compared to programmable solutions) and increasing time to market have prompted the search for other design styles. These include structured ASICs, FPGAs, processor arrays and "platforms", which are all trying to fill the void left by the slowing of ASIC design starts. The reality however is that none has so far proven to be a solution with a wide spectrum of applications, because they are either a limited economic choice or because their performance constraints the application space. This presentation addresses the trade-offs among these design solutions and also looks at several ways of mixing these technologies. These alternative solutions are reviving cell-based design by adding the flexibility of those alternative solutions to the traditional ASIC design.
Keywords
application specific integrated circuits; electronic design automation; field programmable gate arrays; integrated circuit design; ASIC design; ASSP; EDA tools; FPGA; design cost; processor arrays; semiconductor market; standard cell based design; Application specific integrated circuits; Costs; Economic forecasting; Electronic design automation and methodology; Field programmable gate arrays; Space technology; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuits and Systems Design, 2004. SBCCI 2004. 17th Symposium on
Print_ISBN
1-58113-947-0
Type
conf
DOI
10.1109/SBCCI.2004.240870
Filename
1360531
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