DocumentCode
421898
Title
Confining collateral damage to less than 10 nm during femtosecond laser machining
Author
Picard, Yoosuf N. ; Yalisove, Steven M. ; Liu, Hsiao-Hua ; Mourou, Gerard
Author_Institution
Dept. of Mater. Sci. & Eng., Michigan Univ., Ann Arbor, MI, USA
Volume
1
fYear
2004
fDate
16-21 May 2004
Abstract
We have ablated holes in pre-thinned Si foils using an ultrafast laser. High resolution imaging of the edges of these holes reveal collateral damage limited to within 10 nanometers.
Keywords
high-speed optical techniques; image resolution; laser ablation; laser beam machining; silicon; transmission electron microscopy; Si; collateral damage; femtosecond laser machining; high resolution imaging; hole ablation; prethinned Si foils; transmission electron microscopy; ultrafast laser;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 2004. (CLEO). Conference on
Conference_Location
San Francisco, CA
Print_ISBN
1-55752-777-6
Type
conf
Filename
1361350
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