• DocumentCode
    422810
  • Title

    Design, manufacture and application of in-board magnetic devices

  • Author

    Zhang, Yi E. ; Sanders, Seth R.

  • Author_Institution
    Vishay Siliconix Corp., Santa Clara, CA, USA
  • Volume
    3
  • fYear
    2004
  • fDate
    14-16 Aug. 2004
  • Firstpage
    1791
  • Abstract
    Transformers and inductors can be integrated within a multilayer printed circuit board as described (Zhang, YE). These devices offer great advantages in packaging density. The planar type form factor provides for a large surface area to volume ratio, allowing for effective heat transfer from the magnetic device. This paper takes a tilt factor for winding resistances into consideration, and develops a more accurate design methodology for in-board magnetic devices. Manufacture challenges includes burying of magnetic cores, controlling internal stress and plating through deep vias. A propose manufacture process is described in detail. Finally a transformer and an inductor were designed for an example DC-DC converter demonstrating the manufacturability of in-board magnetic devices. Measured parameters match fairly well with the simple models.
  • Keywords
    DC-DC power convertors; heat transfer; inductors; magnetic cores; magnetic devices; printed circuit design; printed circuit manufacture; stress control; transformers; DC-DC converter; heat transfer; in-board magnetic devices; inductors; internal stress control; magnetic core burying; magnetic device application; magnetic device design; magnetic device manufacture; multilayer printed circuit board; packaging density; planar type form factor; plating deep vias; tilt factor; transformers; winding resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Motion Control Conference, 2004. IPEMC 2004. The 4th International
  • Conference_Location
    Xi´an
  • Print_ISBN
    7-5605-1869-9
  • Type

    conf

  • Filename
    1377020