DocumentCode :
42427
Title :
Parallel Circuit Simulation via Binary Link Formulations (PvB)
Author :
Paul, Deleglise ; Nakhla, Michel S. ; Achar, Ramachandra ; Nakhla, Natalie M.
Author_Institution :
Mentor Graphics Corp., Ottawa, ON, Canada
Volume :
3
Issue :
5
fYear :
2013
fDate :
May-13
Firstpage :
768
Lastpage :
782
Abstract :
As circuit sizes increase, a means to improve the performance of simulations without sacrificing the accuracy of the results becomes increasingly essential. To achieve this goal, a new parallel algorithm is presented that allows modern multicore processors to be exploited to realize this performance improvement. These improvements are obtained without sacrificing accuracy or resorting to iterative techniques. The computational complexity of the new algorithm is compared with the previously published algorithms based on the domain decomposition (DD) technique. A mathematical proof is presented showing that in the case of the DD algorithm, the CPU cost per iteration as a function of the number of links L between partitions is in the order of O(L2), leading to poor scalability as the number of partitions increases. On the other hand, the proposed algorithm exhibits superior scalability as its complexity increases only in the order of O(L). This result has been verified numerically and the scalability of the proposed algorithm is demonstrated with several industrial examples.
Keywords :
circuit simulation; computational complexity; iterative methods; multiprocessing systems; network analysis; parallel algorithms; DD technique; PvB; binary link formulations; computational complexity; domain decomposition technique; iterative techniques; mathematical proof; multicore processors; parallel algorithm; parallel circuit simulation; Circuit simulation; Integrated circuit modeling; Mathematical model; Partitioning algorithms; Scalability; Time domain analysis; Vectors; Binary links; Newton–Raphson iterations; SPICE; circuit simulation; cloud computing; companion form; distributed computing; domain decomposition; multicore; node tearing; parallel simulation; transient analysis;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2237228
Filename :
6449301
Link To Document :
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