• DocumentCode
    424373
  • Title

    Simultaneous short-path and long-path timing optimization for FPGAs

  • Author

    Fung, Ryan ; Betz, Vaughn ; Chow, William

  • Author_Institution
    Toronto Technol. Center, Altera Corp., Toronto, Ont., Canada
  • fYear
    2004
  • fDate
    7-11 Nov. 2004
  • Firstpage
    838
  • Lastpage
    845
  • Abstract
    This work presents the routing cost valleys (RCV) algorithm - the first published algorithm that simultaneously optimizes all short- and long-path timing constraints in a field-programmable gate array (FPGA). RCV is comprised of a new slack allocation algorithm that produces both minimum and maximum delay budgets for each circuit connection, and a new router that strives to meet and, if possible, surpass these connection delay constraints. RCV achieves excellent results. On a set of 100 large circuits, RCV improves both long-path and short-path timing slack significantly vs. an earlier computer-aided design (CAD) system that focuses solely on long-path timing. Even with no short-path timing constraints, RCV improves the clock speed of circuits by 3.9% on average. Finally, RCV is able to meet timing on all 72 peripheral component interconnect (PCI) cores tested, while an earlier algorithm fails to achieve timing on all 72 cores.
  • Keywords
    circuit optimisation; field programmable gate arrays; network routing; timing; circuit connection; clock speed; connection delay constraints; field-programmable gate array; long-path timing optimization; long-path timing slack; maximum delay budget; minimum delay budget; peripheral component interconnect cores; routing cost valleys algorithm; short-path timing optimization; short-path timing slack; slack allocation algorithm; Circuit testing; Clocks; Constraint optimization; Cost function; Delay; Design automation; Field programmable gate arrays; Integrated circuit interconnections; Routing; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2004. ICCAD-2004. IEEE/ACM International Conference on
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-8702-3
  • Type

    conf

  • DOI
    10.1109/ICCAD.2004.1382691
  • Filename
    1382691