Title :
On the wafer/pad friction of linear chemical-mechanical planarization (CMP): modeling, analysis and experiments
Author_Institution :
Cleaning Technol. Div., Lam Res. Corp., Fremont, CA, USA
fDate :
June 30 2004-July 2 2004
Abstract :
In this paper, we present a modeling and monitoring scheme of the friction between the wafer and polishing pad for the linear chemical-mechanical planarization (CMP) processes. Kinematic analysis of the linear CMP system is investigated and a distributed LuGre dynamic friction model is utilized to capture the friction forces generated by the wafer/pad interactions. We present an experimental validation of wafer/pad friction modeling and analysis. Pad conditioning and wafer film topography effects on the wafer/pad friction are also experimentally demonstrated. Finally, one application example is illustrated the use of friction torques for real-time monitoring the shallow trench isolation (STI) CMP processes.
Keywords :
chemical mechanical polishing; friction; isolation technology; linear systems; planarisation; semiconductor process modelling; distributed LuGre dynamic friction model; friction forces; friction torques; kinematic analysis; linear chemical-mechanical planarization analysis; linear chemical-mechanical planarization modeling; linear system; polishing pad; real time monitoring; shallow trench isolation; wafer film topography effects; wafer-pad friction analysis; wafer-pad friction modeling;
Conference_Titel :
American Control Conference, 2004. Proceedings of the 2004
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-8335-4