Title :
A high-throughput 5 Gbps timing and jitter test module featuring localized processing
Author :
Hafed, Mohamed M. ; Chan, Antonio H. ; Duerden, Geoffrey ; Pishdad, B. ; Tam, Clarence ; Laberge, Sebastien ; Roberts, Gordon W.
Author_Institution :
DFT, MicroSyst. Canada Inc., Montreal, Canada
Abstract :
A compact timing and jitter test system that leverages custom integrated circuit measurement methods and localized test result processing is presented. It consists of five timing measurement units (TMU) and five timing generation units (TGU) as well as hardware digital processing units for local test result processing or parameter extraction. The TMU channels rely on a component-invariant vernier-delay measurement circuit and the TGU channels rely on linear programmable delay circuitry. The system supports both LVDS and CML highspeed digital interface standards at rates of up to 5 Gbps. This solution occupies 3"×4" of board area, which makes it suitable for placement on the DUT-board. It has a relative delay generation resolution of 3 ps at 5 Gbps, and is capable of autonomous, platform-independent pass-fail testing.
Keywords :
automatic test equipment; current-mode logic; design for testability; integrated circuit measurement; integrated circuit testing; jitter; timing; 3 ps; 5 Gbit/s; CML highspeed digital interface standards; LVDS; autonomous testing; component invariant vernier delay measurement circuit; device under test board; hardware digital processing units; integrated circuit measurement methods; jitter test module; jitter test system; linear programmable delay circuitry; localized test result processing; parameter extraction; platform independent pass-fail testing; relative delay generation resolution; timing generation units; timing measurement units; timing test module; timing test system; Application specific integrated circuits; Circuit testing; Delay lines; Hardware; Integrated circuit measurements; Integrated circuit testing; Measurement units; Parameter extraction; System testing; Timing jitter;
Conference_Titel :
Test Conference, 2004. Proceedings. ITC 2004. International
Print_ISBN :
0-7803-8580-2
DOI :
10.1109/TEST.2004.1387335