DocumentCode
425730
Title
Implementation of an economic jitter compliance test for a multi-gigabit device on ATE
Author
Hänsel, Gert ; Stieglbauer, Korbinian ; Schulze, Guido ; Moreira, Jose
Author_Institution
Infineon Technol. AG, Munich, Germany
fYear
2004
fDate
26-28 Oct. 2004
Firstpage
1303
Lastpage
1312
Abstract
State of the art communication devices combine multiple high-speed interfaces like SFI4.2 and XAUI with speeds up to 3.2 gigabits per second (Gbps) on a single CMOS chip. One key parameter common to the specification of these interfaces is the jitter observed on the transmitters. Existing automated test approaches are not able to cover this parameter during production test at a reasonable economical performance, determined by the following items: capital investment, time-to-market (TTM) and test cost per chip. This work includes a discussion of the need for jitter separation, a thorough review of jitter separation algorithms and also presents the results of a specific jitter separation approach with an at-speed ATE system.
Keywords
CMOS integrated circuits; automatic test equipment; automatic testing; high-speed integrated circuits; integrated circuit economics; integrated circuit testing; jitter; production testing; time to market; transmitters; ATE system; SFI4.2 interface; XAUI interface; automated test method; capital investment; communication devices; economic jitter compliance test; jitter separation algorithms; multigigabit device; multiple high speed interfaces; production test; single CMOS chip; test cost per chip; time to market; transmitters; Automatic testing; CMOS process; CMOS technology; Circuit testing; Jitter; Optical transmitters; Production; SONET; Semiconductor device measurement; Software testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2004. Proceedings. ITC 2004. International
Print_ISBN
0-7803-8580-2
Type
conf
DOI
10.1109/TEST.2004.1387405
Filename
1387405
Link To Document