DocumentCode
425742
Title
Diagnosis meets physical failure analysis: how long can we succeed?
Author
Gattiker, Anne
Author_Institution
IBM Austin Res. Lab., TX, USA
fYear
2004
fDate
26-28 Oct. 2004
Firstpage
1441
Abstract
Detecting real defects, increases the fabrication facility´s urgency to eliminate the source of the defect and gives assurance to the customer that the quality enhancement process is in action. Such satisfying moments may be more and more rare, however, as challenges to the physical failure analysis process make it increasingly difficult to get such pictures and as failure modes themselves become less amenable to the same. As challenges to physical failure analysis increasingly relegate it to a sampling/verification role, opportunities such as innovative use of process monitors and test structures and circuit-behavior/simulation-based pointers to failure root cause must increasingly be exploited and increasingly trusted as high-fidelity guide to yield learning.
Keywords
failure analysis; fault simulation; integrated circuit testing; quality assurance; defect detection; fault simulation; integrated circuit testing; physical failure analysis; quality assurance; quality enhancement; Circuit faults; Circuit simulation; Circuit testing; Crosstalk; Fabrication; Failure analysis; Logic testing; Manufacturing processes; Timing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2004. Proceedings. ITC 2004. International
Print_ISBN
0-7803-8580-2
Type
conf
DOI
10.1109/TEST.2004.1387449
Filename
1387449
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