Cost-efficient design of 3D integrated RF and microwave modules for wireless communication systems

This paper presents a novel efficient design approach for faster and more profitable development of highly integrated RF and microwave modules. To demonstrate the feasibility of the proposed design concept, a three-dimensionally (3D) integrated BGA filter module applicable in microwave link communications is designed at K-hand. Special emphasis is given to the design of various novel wideband module transitions with excellent transfer characteristic up to the millimeter-wave band. Finally, the design of a complete filter module with board-level BGA interconnections is validated with full-wave electromagnetic simulation of the entire packaging structure.