Title :
Design for electrical performance of wideband multilayer LTCC microstrip-to-stripline transition
Author :
Jhuang, Huei-Han ; Huang, Tian-Wei
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
A high impedance compensation technique is proposed to improve the wideband performance of the microstrip-to-stripline transition for multilayer LTCC substrate. A section of high impedance transmission line, which induces additional inductance, is added between the transition and 50 Ω transmission line to compensate the capacitance of the transition. In the paper, various lengths and widths of the high impedance transmission line are simulated by HFSS and compared to optimize the electrical performance which achieves a return loss better than 17 dB over a band from DC to 70 GHz.
Keywords :
ceramic packaging; microstrip transitions; transmission lines; 0 to 70 GHz; 50 ohm; HFSS simulation; LTCC substrate; capacitance; electrical performance design; high impedance transmission line; impedance compensation; inductance; microstrip-to-stripline transition; wideband multilayer LTCC; wideband performance; Ceramics; Coplanar transmission lines; Distributed parameter circuits; Impedance; Microstrip; Nonhomogeneous media; Permittivity; Stripline; Transmission lines; Wideband;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396661
