Hybrid technique modeling of a generic feeding network for highly integrated RF transceivers

Author

Wang, J.J. ; Lu, A.C.W. ; Zhang, Y.P.

Author_Institution

Sch. of EEE, Nanyang Technol. Univ., Singapore

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

661

Lastpage

663

Abstract

This work presents the circuit modelling methodology of a generic feeding network for highly integrated RF transceiver modules. The feeding network consists of module or package interconnects including bond wires, signal traces and vias. Analytical and numerical modelling techniques are applied to calculate the circuit parameters. This circuit modelling approach is also compared with full-wave 3D electromagnetic simulations.

Keywords

equivalent circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; parameter estimation; radiofrequency integrated circuits; transceivers; wires (electric); analytical modelling techniques; bond wires; circuit modelling methodology; circuit parameters; full-wave 3D electromagnetic simulations; generic feeding network; highly integrated RF transceivers; hybrid technique modeling; numerical modelling techniques; package interconnects; signal traces; vias; Analytical models; Bonding; Circuit simulation; Electromagnetic modeling; Integrated circuit interconnections; Numerical models; Packaging; Radio frequency; Transceivers; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396691

Filename

1396691