Title :
Hybrid technique modeling of a generic feeding network for highly integrated RF transceivers
Author :
Wang, J.J. ; Lu, A.C.W. ; Zhang, Y.P.
Author_Institution :
Sch. of EEE, Nanyang Technol. Univ., Singapore
Abstract :
This work presents the circuit modelling methodology of a generic feeding network for highly integrated RF transceiver modules. The feeding network consists of module or package interconnects including bond wires, signal traces and vias. Analytical and numerical modelling techniques are applied to calculate the circuit parameters. This circuit modelling approach is also compared with full-wave 3D electromagnetic simulations.
Keywords :
equivalent circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; parameter estimation; radiofrequency integrated circuits; transceivers; wires (electric); analytical modelling techniques; bond wires; circuit modelling methodology; circuit parameters; full-wave 3D electromagnetic simulations; generic feeding network; highly integrated RF transceivers; hybrid technique modeling; numerical modelling techniques; package interconnects; signal traces; vias; Analytical models; Bonding; Circuit simulation; Electromagnetic modeling; Integrated circuit interconnections; Numerical models; Packaging; Radio frequency; Transceivers; Wires;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396691
