DocumentCode :
427438
Title :
Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder joints
Author :
Che, F.X. ; Pang, John H L
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
fYear :
2004
fDate :
8-10 Dec. 2004
Firstpage :
787
Lastpage :
792
Abstract :
In this work, thermal cycling reliability test and analysis for PBGA components with Sn-3.8Ag-0.7Cu solder joints were investigated. Based on test results, a two-parameter Weibull distribution model was used to determine the mean time to failure (MTTF) of PBGA components. The MTTF was used for validation of finite element analysis (FEA) results. FEA analysis using quarter model and submodeling method was implemented to study stress strain behavior of Sn-3.8Ag-0.7Cu lead free solder joints considering three thermal cycles. In FEA analysis, two different solder joint material constitutive models, viscoplastic Anand´s model and elastic-plastic-creep model, and two different fatigue life prediction models, energy based and strain based fatigue life model, were used for comparison. Volume averaged method was used for extracting fatigue life prediction parameter. Traditional whole interface layer elements averaged method overestimates the fatigue life of solder joint due to lower energy or strain used in fatigue life model. In this paper, new averaging volume of outermost ring elements was proposed. It was shown that outermost ring elements averaging method gave better result compared to MTTF. Thermal cycling and thermal shock loads were simulated in FEA analysis to study the temperature ramp rate effects on fatigue life.
Keywords :
Weibull distribution; ball grid arrays; copper alloys; finite element analysis; mechanical testing; plastic packaging; reliability; silver alloys; solders; thermal stress cracking; tin alloys; PBGA; Sn-3.8Ag-0.7Cu solder joints; SnAgCu; Weibull distribution model; elastic-plastic-creep model; energy based fatigue life model; fatigue life prediction models; finite element analysis; lead free solder joints; mean time to failure; solder joint material constitutive models; strain based fatigue life model; stress strain behavior; thermal cycling reliability test; thermal fatigue reliability analysis; viscoplastic Anand model; volume averaged method; Capacitive sensors; Fatigue; Finite element methods; Lead; Predictive models; Soldering; Testing; Thermal loading; Thermal stresses; Weibull distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
Type :
conf
DOI :
10.1109/EPTC.2004.1396715
Filename :
1396715
Link To Document :
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