DocumentCode :
42809
Title :
Two ESD Detection Circuits for 3x VDD-Tolerant I/O Buffer in Low-Voltage CMOS Processes With Low Leakage Currents
Author :
Hongxia Liu ; Zhaonian Yang ; Qingqing Zhuo
Author_Institution :
Key Lab. of Minist. of Educ. for Wide Band-Gap Semicond. Mater. & Devices, Xidian Univ., Xi´an, China
Volume :
13
Issue :
1
fYear :
2013
fDate :
Mar-13
Firstpage :
319
Lastpage :
321
Abstract :
Two novel 3×VDD-tolerant electrostatic discharge (ESD) protection circuits using only low-voltage devices without extra power consumption are proposed for 0.18- μm 1.8-V and 90-nm 1.2-V CMOS processes, respectively. Stacked-capacitor technique and bias circuit are adopted in the two designs. The proposed ESD detection circuits can generate 36- and 38-mA currents to trigger the ESD clamp device under the ESD event. Under normal operating conditions, all the devices are free from the gate-oxide reliability threat. The leakage currents of the 0.18- μm and 90-nm circuits are 0.9 and 200 nA under 3×VDD, respectively. The simulation results show that both the circuits can be successfully used for 3×VDD-tolerant I/O buffers.
Keywords :
CMOS integrated circuits; electrostatic discharge; integrated circuit reliability; ESD clamp device; ESD detection circuit; VDD-tolerant I/O buffer; VDD-tolerant electrostatic discharge protection circuit; bias circuit; current 36 mA; current 38 mA; gate-oxide reliability threat; low-voltage CMOS process; size 0.18 mum; size 90 nm; stacked-capacitor technique; voltage 1.2 V; voltage 1.8 V; CMOS process; Clamps; Electrostatic discharges; Leakage current; Logic gates; MOSFETs; Thyristors; 3$times$ VDD-tolerant clamp circuit; Bias circuit; electrostatic discharge (ESD); gate reliability; stacked capacitor;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2012.2218606
Filename :
6302182
Link To Document :
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