• DocumentCode
    430020
  • Title

    TRIZ-aided technology mapping for information system implementation

  • Author

    Chan, Joseph W K ; Yu, K.M.

  • Author_Institution
    Dept. of Ind. & Syst. Eng., Hong Kong Polytech Univ., China
  • Volume
    1
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    239
  • Abstract
    The accelerating development of technology transfer and knowledge diffusion activities have a profound impact in technology oriented companies. Technology mapping is a high level-planning tool for supporting the planning and control of technology management, and to support national and sector ´foresight´ initiatives. However, existing models on technology transfer have investigated separately on the methods, stakeholders, and the elements of how the transferers and transferees assimilate, adopt, develop, and transfer the technology in various organizational settings. This research investigates for a structured approach via knowledge networks for the analysis of technological merits that leads to a competitive advantage, with due considerations basing on the impact of technology to a value chain. A 3-dimensional model in the context of technology mapping for the transfer of technology using TRIZ (theory of inventive problem solving) is proposed. A case study is discussed to illustrate the systematic application of the model.
  • Keywords
    information systems; planning; technology management; technology transfer; TRIZ-aided technology mapping; high level-planning tool; information system; knowledge diffusion activities; organizational settings; technology management; technology oriented companies; technology transfer; theory of inventive problem solving; Acceleration; Business; Commercialization; Context modeling; Electrical equipment industry; Information systems; Problem-solving; Technology management; Technology planning; Technology transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering Management Conference, 2004. Proceedings. 2004 IEEE International
  • Print_ISBN
    0-7803-8519-5
  • Type

    conf

  • DOI
    10.1109/IEMC.2004.1407112
  • Filename
    1407112