Low-cost millimeter-wave transceiver module using SMD packaged MMICs

This paper presents a novel approacb to realize low-cost millimeter-wave modules using only SMD packaged MMlCs integrated on a single organic substrate. This approach is demonstrated on a 38GHz trausceiver module for point-to-point LMDS communication systems. The required SMD package technology and demonstrator have been developed in the 5th framework European IST project ??Surface Mount Assembly for Commuuication Kband Systems?? (SMACKS). Two types of SMD packages have been developed based on LTCC techuology for the low-power devices and an organic package for the highpower amplifier. The use of only packaged devices enables low-cost module manufacturing without tbe need for specialized equipment and without yield loss from baudling bare die MMICs. The estimated cost reduction of such a module, with respect to a module using bare die components and mixed substrate technologies, is around 20%. A disadvantage of this approacb is that the density of integration is low, since each active device is housed in its own package.