Microstrip to surface mounted foam-based waveguide transition for Ka-band filter integration

Author

Lohinetong, D. ; Thévenard, J. ; Nicolas, C. ; Minard, Ph ; Louzir, A. ; Coupez, Ph ; Person, C.

Author_Institution

THOMSON R&D France, France

fYear

2004

fDate

18-21 Aug. 2004

Firstpage

899

Lastpage

902

Abstract

This paper introduces a novel transition structure between a microstrip line and a surface mounted waveguide. The waveguide structure is based on foam material and comprises a flange cavity, the design of which aims both to achieve the impedance matching of the transition and to enable potentially a fully automated assembly onto an RF printed circuit board (PCB), complying so with surface mounted device (SMD) technology. The new concept has been applied to two 30GHz waveguide filter designs, presenting respectively a Chebyshev and a pseudo-elliptic response.

Keywords

assembling; foams; impedance matching; microwave filters; surface mount technology; waveguide filters; 30 GHz; Chebyshev response; Ka-band filter integration; RF printed circuit board; flange cavity; foam material; fully automated assembly; impedance matching; microstrip line; pseudo-elliptic response; surface mounted device; surface mounted waveguide; waveguide filter; waveguide structure; waveguide transition; Assembly; Flanges; Impedance matching; Microstrip filters; Printed circuits; Radio frequency; Surface waves; Surface-mount technology; Waveguide components; Waveguide transitions;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Technology, 2004. ICMMT 4th International Conference on, Proceedings

Print_ISBN

0-7803-8401-6

Type

conf

DOI

10.1109/ICMMT.2004.1411676

Filename

1411676