DocumentCode
432076
Title
Finite element analysis of temperature rise from an integrated 3-D intracardiac echo and ultrasound ablation transducer
Author
Gentry, Kenneth L. ; Palmeri, Mark L. ; Sachedina, Nasheer ; Smith, Stephen W.
Author_Institution
Dept. of Biomed. Eng., Duke Univ., Durham, NC, USA
Volume
1
fYear
2004
fDate
23-27 Aug. 2004
Firstpage
122
Abstract
A method for simulating the temperature rise due to acoustic heating from an ablation transducer is introduced. The size of lesions produced by this temperature rise is also modeled. First the intensity from the transducer is calculated using Field II. This intensity is scaled to a measured value and converted into acoustic heat generation. Finite element analysis is then used to find the temperature rise in tissue from this heat generation. The thermal dose is calculated and from that the size of any lesions may be predicted. We validate the model by comparing simulated results to experimental results from an ablation ring transducer. Temperatures were within 2°C of the experiment after a 2 minute ablation. The simulation predicted a lesion size of 1.75 mm deep by 5.5 mm in diameter. The experimental average of four lesions was 1.75 mm deep by 4.6 mm in diameter. The model was then used to predict the temperatures and lesions created by an 86 element linear array transducer in various configurations.
Keywords
biomedical ultrasonics; catheters; finite element analysis; heating; patient treatment; ultrasonic transducer arrays; 1.75 mm; 2 min; 4.6 mm; 5.5 mm; FEM; ablation ring transducer; acoustic heating; catheters; integrated 3D intracardiac echo transducer; lesion size; linear array transducer; thermal dose; tissue temperature rise; ultrasound ablation transducer temperature rise; Acoustic measurements; Acoustic transducers; Finite element methods; Heating; Lesions; Predictive models; Temperature; Ultrasonic imaging; Ultrasonic transducers; Ultrasonic variables measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2004 IEEE
ISSN
1051-0117
Print_ISBN
0-7803-8412-1
Type
conf
DOI
10.1109/ULTSYM.2004.1417683
Filename
1417683
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