• DocumentCode
    432278
  • Title

    Temperature compensated LiTaO3/sapphire bonded SAW substrate with low loss and high coupling factor suitable for US-PCS application

  • Author

    Miura, M. ; Matsuda, T. ; Satoh, Y. ; Ueda, M. ; Ikata, O. ; Ebata, Y. ; Takagi, H.

  • Author_Institution
    Fujitsu Labs. Ltd., Hyogo, Japan
  • Volume
    2
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    1322
  • Abstract
    A novel temperature-compensated SAW substrate was developed based on bonded LiTaO3/sapphire. Because of its small TEC (thermal expansion coefficient) and large Young´s modulus, sapphire is an ideal material for a support substrate. The frequency and temperature characteristics of the bonded LiTaO3/sapphire SAW substrate and its application to a US-PCS duplexer are described.
  • Keywords
    compensation; mobile handsets; personal communication networks; sapphire; substrates; surface acoustic wave filters; LiTaO3; SAW filters; US-PCS duplexer; Young´s modulus; coupling factor; lithium tantalate/sapphire bonded SAW substrate; mobile phones; temperature-compensated SAW substrate; thermal expansion coefficient; Bonding; Degradation; Frequency; Glass; Personal communication networks; Propagation losses; SAW filters; Surface acoustic waves; Temperature; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2004 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-8412-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2004.1418036
  • Filename
    1418036
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=432278