• DocumentCode
    432584
  • Title

    Dispersion analysis of packaged MMIC amplifiers using the compression approach

  • Author

    Lesage, J.-M. ; Loison, R. ; Gillard, R. ; Barbier, T. ; Mancuso, Y.

  • Volume
    2
  • fYear
    2004
  • fDate
    12-14 Oct. 2004
  • Firstpage
    649
  • Lastpage
    652
  • Abstract
    This paper presents the study of packaging effects on MMIC amplifiers using a global EM simulation based on the compression approach. On-wafer measurements are used as MMIC models and a single EM simulation is performed in order to describe their environment. The compression approach pennits to efficiently simulate all chip combinations and thus to perform a dispersion analysis of the packaged MMICs.
  • Keywords
    Analytical models; Calibration; Circuit simulation; Electromagnetic measurements; Electronics packaging; MMICs; Microwave technology; Performance analysis; Performance evaluation; Semiconductor device measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2004. 34th European
  • Conference_Location
    Amsterdam, The Netherlands
  • Print_ISBN
    1-58053-992-0
  • Type

    conf

  • Filename
    1418900
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=432584