Title :
A microstrip-to-microstrip hot-via transition up-to 80 GHz designed for direct PCB mounting of MMICs
Author :
Saboureau, C. ; Baillargeat, Dominique ; Verdeyme, S. ; Bessemoulin, A. ; Bois, J.-R. ; Quentin, P.
Abstract :
This paper presents a new microstrip-tomicrostrip Hot-Via transition designed for SMD MMICs mounted on a PCB carrier substrate. Good RF performance is achieved from DC to 80 GHz which demonstrates the potential of the Hot-Via concept. The broadband transition optimized is generic and can he adapted on a large panel of MMICs.
Keywords :
Assembly; Chip scale packaging; Coplanar transmission lines; Costs; Integrated circuit interconnections; MMICs; Microstrip; Microwave devices; Radio frequency; Substrates;
Conference_Titel :
Microwave Conference, 2004. 34th European
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
1-58053-992-0
