A novel de-embedding technique for on-wafer microwave characterization

This paper presents an improved deembedding method using only two "thru" dummy structures for two-port s-parameter de-embedding based on cascade connection. The improved de-embedding technique can precisely remove the redundant parasitics introduced by the probe pads and interconnects by taking into account the effects of the contact resistances and the step discontinuities. Compared with the conventional method, the proposed one requires less dummies, chip area, and computing time.