A test-chip to characterize the benefit of on-chip decoupling to reduce the electromagnetic emission of integrated circuits

Author

Ostermann, T. ; Bacher, C. ; Schneider, D. ; Gut, W. ; Lackner, C. ; Koessl, R. ; Hagelauer, R. ; Deutschmann, Bernd ; Jungreithmair, R.

Author_Institution

Inst. for Integrated Circuits, Linz Univ.

Volume

1

fYear

2003

fDate

16-16 May 2003

Firstpage

44

Abstract

In this paper we present two test-chips, which were used to characterize the influence of the placement of on-chip decoupling capacitor blocks on the electromagnetic emission of integrated circuits. In general the electromagnetic emission could be reduced by the use of on-chip capacitors, but also an increase of the emission is possible, when these capacitors are not optimally placed

Keywords

capacitors; electromagnetic compatibility; electromagnetic coupling; integrated circuit noise; integrated circuit testing; TEM-cell method; chip level measurements; electromagnetic emission reduction; integrated circuits; on-chip decoupling capacitor blocks; test-chip; Bonding; Circuit testing; Electromagnetic compatibility; Integrated circuit measurements; Integrated circuit modeling; Integrated circuit noise; Integrated circuit testing; MOS capacitors; Packaging; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on

Conference_Location

Istanbul

Print_ISBN

0-7803-7779-6

Type

conf

DOI

10.1109/ICSMC2.2003.1428188

Filename

1428188