Title :
A test-chip to characterize the benefit of on-chip decoupling to reduce the electromagnetic emission of integrated circuits
Author :
Ostermann, T. ; Bacher, C. ; Schneider, D. ; Gut, W. ; Lackner, C. ; Koessl, R. ; Hagelauer, R. ; Deutschmann, Bernd ; Jungreithmair, R.
Author_Institution :
Inst. for Integrated Circuits, Linz Univ.
Abstract :
In this paper we present two test-chips, which were used to characterize the influence of the placement of on-chip decoupling capacitor blocks on the electromagnetic emission of integrated circuits. In general the electromagnetic emission could be reduced by the use of on-chip capacitors, but also an increase of the emission is possible, when these capacitors are not optimally placed
Keywords :
capacitors; electromagnetic compatibility; electromagnetic coupling; integrated circuit noise; integrated circuit testing; TEM-cell method; chip level measurements; electromagnetic emission reduction; integrated circuits; on-chip decoupling capacitor blocks; test-chip; Bonding; Circuit testing; Electromagnetic compatibility; Integrated circuit measurements; Integrated circuit modeling; Integrated circuit noise; Integrated circuit testing; MOS capacitors; Packaging; Voltage;
Conference_Titel :
Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on
Conference_Location :
Istanbul
Print_ISBN :
0-7803-7779-6
DOI :
10.1109/ICSMC2.2003.1428188
