DocumentCode
434828
Title
Study on the failure mechanism of the electronic device in the transient electromagnetic field
Author
Di-Chen, Liu ; Li, Zhang ; Chuan, Li ; Guanghui, Chang ; Qing, Wang ; Jiang-Feng, Zou
Author_Institution
Sch. of Electr. Eng., Wuhan Univ., Hubei, China
Volume
2
fYear
2003
fDate
11-16 May 2003
Firstpage
1036
Abstract
This article introduces many kinds of interference and damage tests of electronic equipments, automatics and electric device in the transient electromagnetic field and steady-state electromagnetic field, and has got a series of interference phenomena and results of the tests. We have carried on the analysis of inside effect and mechanism on the outside electromagnetic field acting on the electronic device. Carrier movement law and thermal effect within the electronic device are the main reasons for causing the electronic device failure and damage after studying under electromagnetic field function. We draw a series of important conclusions that the different intensities of field and different devices receive interference and failure.
Keywords
electromagnetic fields; electromagnetic interference; electron device testing; electronic equipment testing; failure analysis; radiation effects; semiconductor device reliability; automatic device; carrier movement law; damage tests; electric device; electronic device; electronic equipments; failure mechanism; field intensity; interference phenomenon; steady state electromagnetic field; thermal effect; transient electromagnetic field; Automatic testing; Circuit testing; Cities and towns; Electromagnetic fields; Electromagnetic interference; Electromagnetic transients; Electronic equipment; Electronic equipment testing; Failure analysis; Lightning;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on
Print_ISBN
0-7803-7779-6
Type
conf
DOI
10.1109/ICSMC2.2003.1429091
Filename
1429091
Link To Document