Title :
An Accurate FDTD Model for Crosstalk Analysis of CMOS-Gate-Driven Coupled RLC Interconnects
Author :
Kumar, Vobulapuram Ramesh ; Kaushik, B.K. ; Patnaik, Amalendu
Author_Institution :
Dept. of Electron. & Commun. Eng., Indian Inst. of Technol. Roorkee, Roorkee, India
Abstract :
This paper accurately models the crosstalk effects in a CMOS-gate-driven coupled RLC interconnects using the nth power law model and finite-difference time-domain (FDTD) technique. The propagation delay, peak crosstalk voltage, and peak voltage timing on victim line of coupled-multiple lines are observed and compared to HSPICE simulation results for the global interconnect length at 32 nm technology node. The numerical results illustrate that the proposed model accurately estimates the performance parameters of driver interconnect load system. An average error of less than 2% is observed in estimation of peak crosstalk voltage and its timing. The proposed model can be extended for coupled n lines and useful for the evaluation of signal integrity, issues of EMI, and EMC of on-chip interconnects.
Keywords :
CMOS analogue integrated circuits; RLC circuits; crosstalk; electromagnetic compatibility; electromagnetic interference; finite difference time-domain analysis; integrated circuit interconnections; CMOS-gate-driven coupled RLC interconnects; EMC issue; EMI issue; FDTD model; FDTD technique; HSPICE simulation; coupled-multiple lines; crosstalk analysis; driver interconnect load system; finite-difference time-domain technique; global interconnect length; nth power law model; on-chip interconnects; peak crosstalk voltage; peak voltage timing; propagation delay; signal integrity evaluation; size 32 nm; victim line; Analytical models; CMOS integrated circuits; Crosstalk; Finite difference methods; Load modeling; Semiconductor device modeling; Time-domain analysis; CMOS; crosstalk; finite-difference time-domain (FDTD); on-chip interconnects; signal integrity;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2014.2305801