DocumentCode
435710
Title
Corner effects in vertical MOSFETs
Author
Hou, Xiaoyu ; Zhou, Falong ; Huang, Ru ; Zhang, Xing
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing, China
Volume
1
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
134
Abstract
Two kinds of corner effects existing in vertical channel gate-all-around (GAA) MOSFETs have been investigated via three-dimensional (3D) and two-dimensional (2D) simulations. Through comparison between the gate-all-around (GAA) and double-gate (DG) vertical transistors, it is found that the kind of corner effect caused by conterminous gate plays contrary roles in the GAA vertical transistors. It can suppress the leakage current at low channel doping while enhance the leakage current at high channel doping. The study of another kind of corner effect, which exists in the terminal of the channel, shows that D-top structure (drain on the lop of device pillar) of vertical transistor has much lower leakage current and better DIBL effect immunity than S-top structure (source on the top of device pillar).
Keywords
MOSFET; circuit simulation; electronic engineering computing; leakage currents; semiconductor doping; 2D simulations; 3D simulation; channel doping; conterminous gate; corner effects; double-gate vertical transistors; gate-all-around transistors; leakage current; vertical MOSFET; vertical channel MOSFET; Doping; Etching; Impurities; Leakage current; Lithography; MOSFETs; Microelectronics; Shape; Silicon; Tiles;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN
0-7803-8511-X
Type
conf
DOI
10.1109/ICSICT.2004.1434971
Filename
1434971
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