• DocumentCode
    435710
  • Title

    Corner effects in vertical MOSFETs

  • Author

    Hou, Xiaoyu ; Zhou, Falong ; Huang, Ru ; Zhang, Xing

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • Volume
    1
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    134
  • Abstract
    Two kinds of corner effects existing in vertical channel gate-all-around (GAA) MOSFETs have been investigated via three-dimensional (3D) and two-dimensional (2D) simulations. Through comparison between the gate-all-around (GAA) and double-gate (DG) vertical transistors, it is found that the kind of corner effect caused by conterminous gate plays contrary roles in the GAA vertical transistors. It can suppress the leakage current at low channel doping while enhance the leakage current at high channel doping. The study of another kind of corner effect, which exists in the terminal of the channel, shows that D-top structure (drain on the lop of device pillar) of vertical transistor has much lower leakage current and better DIBL effect immunity than S-top structure (source on the top of device pillar).
  • Keywords
    MOSFET; circuit simulation; electronic engineering computing; leakage currents; semiconductor doping; 2D simulations; 3D simulation; channel doping; conterminous gate; corner effects; double-gate vertical transistors; gate-all-around transistors; leakage current; vertical MOSFET; vertical channel MOSFET; Doping; Etching; Impurities; Leakage current; Lithography; MOSFETs; Microelectronics; Shape; Silicon; Tiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
  • Print_ISBN
    0-7803-8511-X
  • Type

    conf

  • DOI
    10.1109/ICSICT.2004.1434971
  • Filename
    1434971