DocumentCode :
435820
Title :
Effects of integration processes on the ferroelectric performance of SrBi2Ta2O9 capacitors
Author :
Zhang, Zhigang ; Zhu, Jun ; Xie, Dan ; Liu, Zhihong
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Volume :
1
fYear :
2004
fDate :
18-21 Oct. 2004
Firstpage :
742
Abstract :
The ferroelectric properties of integrated Pt/SrBi2Ta2O9/Pt capacitors by insulator layer deposition and contact photo etching were investigated. Integration processes, especially the introduced ions and electrons play an important role for the degradation of SBT capacitors. After insulator layer deposition and contact photo etching, a significant reduction in polarization was observed, and this reduction can be recovered well by recovery annealing in oxygen. The experimental result demonstrates that the integration processes can produce the ions, electrons and other defects, which has an obvious effect on the polarization of SBT capacitors. Also, the introduced defects can affect the leakage current and retention behavior.
Keywords :
bismuth compounds; chemical vapour deposition; dielectric polarisation; etching; ferroelectric capacitors; leakage currents; platinum; strontium compounds; tantalum compounds; Pt-SrBi2Ta2O9-Pt; SBT capacitors; contact photo etching; ferroelectric performance; insulator layer deposition; integration processes; leakage current; polarization reduction; recovery annealing; retention behavior; Annealing; Capacitors; Degradation; Etching; Ferroelectric films; Ferroelectric materials; Insulation; Nonvolatile memory; Polarization; Random access memory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
Type :
conf
DOI :
10.1109/ICSICT.2004.1435110
Filename :
1435110
Link To Document :
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