• DocumentCode
    435919
  • Title

    Efficient 3-D interconnect capacitance extraction based on direct solving techniques for system with multiple right-hand sides

  • Author

    Liu, Hong ; Yu, Wenjian ; Wang, Zeyi

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • Volume
    2
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    1042
  • Abstract
    Under the current deep submicron technology, the capacitance extraction of interconnects has become more and more important and more coupling capacitances need to be extracted accurately rather than those related with a single master net for high-precision time verification. Therefore, for a simulated structure, IV voltage must be set on different conductors one by one and the corresponding linear system with multiple right-hand sides (RHS) should be solved efficiently. In this paper, direct equation solving techniques are presented to extract the parasitic capacitances with multiple master conductors. Combined with the quasi-multiple medium (QMM) technology, our method exploits the sparsity of the resulted coefficient matrix and is very suitable for the problem with multiple RHS. The experiments on actual interconnect structures have shown that our method is several times faster than the conventional GMRES solver, while preserving the computational accuracy.
  • Keywords
    capacitance; circuit simulation; conductors (electric); integrated circuit interconnections; matrix algebra; 3D interconnect capacitance extraction; GMRES solver; IV voltage; QMM; RHS; coefficient matrix; coupling capacitance; current deep submicron technology; direct equation solving; high-precision time verification; interconnect structures; linear system; master conductor; multiple right-hand side system; parasitic capacitances; quasi-multiple medium; Capacitance; Capacitors; Computational efficiency; Conductors; Dielectrics; Equations; Gaussian processes; Iterative algorithms; Partitioning algorithms; Sparse matrices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
  • Print_ISBN
    0-7803-8511-X
  • Type

    conf

  • DOI
    10.1109/ICSICT.2004.1436684
  • Filename
    1436684