DocumentCode
435924
Title
A new damage model for ion implantation simulation with molecular dynamics method
Author
Wang, Rong ; Yu, Min ; Zhan, Kai ; Shi, Xiaokang ; Ji, Huihui ; Zhang, Jinyu ; Oka, Hideki
Author_Institution
Inst. of Microelectron., Peking Univ., China
Volume
2
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
1061
Abstract
A new damage model for ion implantation simulation based on molecular dynamic method is introduced in this paper. The model not only describes the formation of point defects but also describe the effect of amorphous pockets. The new model is successfully incorporated into the simulator LEACS (Ran Yajun et al., 2000). Pre-amorphization implantation (PAI) (A. Al-Bayati et al., 2000) with Sb is simulated. The simulation shows obviously better agreement with the RBS results than that achieved with point defects only. The simulation with new damage model can simulate the dose effect in implantation of impurities. Simulations As of and B into single-crystal silicon at 3 kev agree with experimental data.
Keywords
amorphisation; amorphous semiconductors; antimony; ion implantation; molecular dynamics method; silicon; 3 keV; LEACS; PAI; RBS; Sb; Si; amorphous pockets; damage model; impurities implantation; ion implantation simulation; molecular dynamics method; point defects; preamorphization implantation; single-crystal silicon; Amorphous materials; Chaos; Implants; Impurities; Ion implantation; Laboratories; Lattices; Region 7; Research and development; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN
0-7803-8511-X
Type
conf
DOI
10.1109/ICSICT.2004.1436689
Filename
1436689
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