Title :
A novel analytical thermal model for temperature estimation of multilevel ULSI interconnects
Author :
Nai-Long, Wang ; Run-De, Zhou
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
The increasing temperature rise of on-chip interconnects has been the very important constraints for high performance chip design. In this paper, we present a novel analytical thermal model for estimating the temperature rise of multilevel ULSI interconnects, and investigate in detail the impact of joule heating, via effect and heat fringing effect. After considering the via effect and heat fringing effect of multilevel ULSI interconnects, LTem provides more accurate temperature estimation of the multilevel interconnects.
Keywords :
ULSI; heating; integrated circuit interconnections; temperature measurement; thermal conductivity; analytical thermal model; heat fringing effect; joule heating; multilevel ULSI interconnects; on-chip interconnects; temperature rise estimation; thermal conductivity; via effect; Analytical models; Geometry; Heating; Insulation; Integrated circuit interconnections; Tellurium; Temperature distribution; Thermal conductivity; Ultra large scale integration; Wire;
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
DOI :
10.1109/ICSICT.2004.1436698
