A novel analytical thermal model for temperature estimation of multilevel ULSI interconnects

Author

Nai-Long, Wang ; Run-De, Zhou

Author_Institution

Inst. of Microelectron., Tsinghua Univ., Beijing, China

Volume

2

fYear

2004

fDate

18-21 Oct. 2004

Firstpage

1088

Abstract

The increasing temperature rise of on-chip interconnects has been the very important constraints for high performance chip design. In this paper, we present a novel analytical thermal model for estimating the temperature rise of multilevel ULSI interconnects, and investigate in detail the impact of joule heating, via effect and heat fringing effect. After considering the via effect and heat fringing effect of multilevel ULSI interconnects, LTem provides more accurate temperature estimation of the multilevel interconnects.

Keywords

ULSI; heating; integrated circuit interconnections; temperature measurement; thermal conductivity; analytical thermal model; heat fringing effect; joule heating; multilevel ULSI interconnects; on-chip interconnects; temperature rise estimation; thermal conductivity; via effect; Analytical models; Geometry; Heating; Insulation; Integrated circuit interconnections; Tellurium; Temperature distribution; Thermal conductivity; Ultra large scale integration; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on

Print_ISBN

0-7803-8511-X

Type

conf

DOI

10.1109/ICSICT.2004.1436698

Filename

1436698