DocumentCode
436804
Title
Cleaning of residual silicon on InP regrowth interface in MOVPE reactor
Author
Naniwae, Koichi ; Ohya, Masaki ; Hamamoto, Kiichi ; Nishi, Kenichi ; Sasaki, Tatsuya
Author_Institution
Syst. Devices Res. Labs, NEC Corp., Shiga, Japan
fYear
2004
fDate
31 May-4 June 2004
Firstpage
126
Lastpage
129
Abstract
Investigating the use of tertiarybutylchloride (TBCl) to clean residual silicon from InP regrowth interfaces in an MOVPE reactor, we found the amount of the residual silicon to be greatly decreased when trimethylindium was supplied together with TBCl in order to balance the etching rate and the growth rate during the cleaning process. Using this cleaning process in the fabrication of buried hetero-structure laser diodes, we demonstrated that it improves their light-current characteristics by reducing the leakage current in the devices.
Keywords
III-V semiconductors; MOCVD; etching; impurities; indium compounds; leakage currents; optical fabrication; semiconductor lasers; surface cleaning; vapour phase epitaxial growth; InP:Si; MOVPE reactor; buried heterostructure laser diodes; etching rate; leakage current; light-current characteristics; regrowth interface; residual silicon cleaning; tertiarybutylchloride; trimethylindium; Cleaning; Diode lasers; Epitaxial growth; Epitaxial layers; Etching; Indium phosphide; Inductors; Leakage current; Optical device fabrication; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials, 2004. 16th IPRM. 2004 International Conference on
ISSN
1092-8669
Print_ISBN
0-7803-8595-0
Type
conf
DOI
10.1109/ICIPRM.2004.1442627
Filename
1442627
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