• DocumentCode
    436804
  • Title

    Cleaning of residual silicon on InP regrowth interface in MOVPE reactor

  • Author

    Naniwae, Koichi ; Ohya, Masaki ; Hamamoto, Kiichi ; Nishi, Kenichi ; Sasaki, Tatsuya

  • Author_Institution
    Syst. Devices Res. Labs, NEC Corp., Shiga, Japan
  • fYear
    2004
  • fDate
    31 May-4 June 2004
  • Firstpage
    126
  • Lastpage
    129
  • Abstract
    Investigating the use of tertiarybutylchloride (TBCl) to clean residual silicon from InP regrowth interfaces in an MOVPE reactor, we found the amount of the residual silicon to be greatly decreased when trimethylindium was supplied together with TBCl in order to balance the etching rate and the growth rate during the cleaning process. Using this cleaning process in the fabrication of buried hetero-structure laser diodes, we demonstrated that it improves their light-current characteristics by reducing the leakage current in the devices.
  • Keywords
    III-V semiconductors; MOCVD; etching; impurities; indium compounds; leakage currents; optical fabrication; semiconductor lasers; surface cleaning; vapour phase epitaxial growth; InP:Si; MOVPE reactor; buried heterostructure laser diodes; etching rate; leakage current; light-current characteristics; regrowth interface; residual silicon cleaning; tertiarybutylchloride; trimethylindium; Cleaning; Diode lasers; Epitaxial growth; Epitaxial layers; Etching; Indium phosphide; Inductors; Leakage current; Optical device fabrication; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 2004. 16th IPRM. 2004 International Conference on
  • ISSN
    1092-8669
  • Print_ISBN
    0-7803-8595-0
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2004.1442627
  • Filename
    1442627