DocumentCode
437108
Title
The future of power semiconductors
Author
Bencuya, Izak
Volume
1
fYear
2005
fDate
6-10 March 2005
Firstpage
18
Abstract
Power semiconductors are taking major change in direction and moving towards distinct bifurcated approaches. The first approach is towards innovations that improve the silicon and process technologies to overcome the limitations of the current technology and the other approach is towards device integration. The latter approach highlights the demand in the market to have more functionality in the same package leading to multi-die designs. Where justified by the market application, these specific products that pack various amounts of functionality and complexity into one component providing highly efficient and specialized performance to accomplish complex functions at the right price for the consumers on time
Keywords
power semiconductor devices; device integration; power semiconductors; process technology improvement; silicon technology improvement; Aerospace industry; Costs; MOSFET circuits; Manufacturing processes; Packaging; Power MOSFET; Power generation; Power system simulation; Silicon; Switched-mode power supply;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Twentieth Annual IEEE
Conference_Location
Austin, TX
Print_ISBN
0-7803-8975-1
Type
conf
DOI
10.1109/APEC.2005.1452878
Filename
1452878
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