Title :
Thermal performance of water-cooled heat sinks
Author :
Salem, T.E. ; Bayne, S.B. ; Porschet, D. ; Chen, Y.
Author_Institution :
Dept. of Electr. Eng., US Naval Acad., Annapolis, MD
Abstract :
As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink
Keywords :
MOSFET; heat sinks; power electronics; thermal management (packaging); MOSFET; power density; power electronic; thermal management; water-cooled microchannel heat sink; water-cooled pole-arrayed heat sink; Electronic packaging thermal management; Energy management; Heat sinks; MOSFET circuits; Power electronics; Switches; Thermal management; Thermal management of electronics; Voltage; Water heating;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Twentieth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8975-1
DOI :
10.1109/APEC.2005.1452902
