DocumentCode :
437226
Title :
A die-scale micromachining process for bulk PZT and its application to in-plane actuators
Author :
Li, Tao ; Gianchandani, Yogesh B.
Author_Institution :
Eng. Res. Center for Wireless Integrated Syst., Michigan Univ., Ann Arbor, MI, USA
fYear :
2005
fDate :
30 Jan.-3 Feb. 2005
Firstpage :
387
Lastpage :
390
Abstract :
Bulk ceramics (including PZT) are important materials for electronic and microsystem packaging or device applications, but they are usually difficult to pattern lithographically. A fabrication process combining lithography, electroplating, batch mode micro electro-discharge machining (μEDM) and batch mode micro ultrasonic machining (μUSM), LEEDUS, has been developed to provide die-scale pattern transfer capability from lithographic masks onto ceramics, glass or other brittle materials. A related process (SEDUS) uses serial μEDM and omits lithography. Feature sizes of 25 μm have been micromachined on the glass-mica (Macor™) ceramic plate with a 4.5×4.5 mm2 die size, 34 μm cutting depth, and 18 μm/min machining rate. As a demonstration an octagonal spiral shaped in-plane actuator was fabricated from bulk PZT using this process. A device of 20 μm thickness and 450 μm × 420 μm footprint produces a displacement of ∼2 μm at 40 V.
Keywords :
electroplating; glass; mica; microactuators; micromachining; photolithography; piezoceramics; ultrasonic machining; μUSM; 20 micron; 25 micron; 34 micron; 40 V; LEEDUS; Macor ceramic plate; SEDUS; batch mode micro electro-discharge machining; batch mode micro ultrasonic machining; bulk PZT; bulk ceramics; die-scale micromachining process; die-scale pattern transfer capability; electroplating; glass-mica ceramic plate; in-plane actuators; lithographic masks; lithography; octagonal spiral shaped in-plane actuator; serial μEDM; Actuators; Ceramics; Electronics packaging; Fabrication; Glass; Lithography; Machining; Micromachining; Packaging machines; Spirals;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
ISSN :
1084-6999
Print_ISBN :
0-7803-8732-5
Type :
conf
DOI :
10.1109/MEMSYS.2005.1453948
Filename :
1453948
Link To Document :
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