• DocumentCode
    437234
  • Title

    Multi-user hybrid process platform for MEMS devices using silicon-on-insulator wafers

  • Author

    Lin, P. ; Boysel, R.M. ; Boysel, M. ; Winters, M. ; Hawkins, W. ; Kubby, J. ; Gulvin, P. ; Diehl, J. ; Feinberg, K. ; German, K. ; Herko, L. ; Jia, N. ; Ma, J. ; Meyers, J. ; Nystrom, P. ; Wang, Y.R.

  • Author_Institution
    Infotonics Technol. Center, Canandaigua, NY, USA
  • fYear
    2005
  • fDate
    30 Jan.-3 Feb. 2005
  • Firstpage
    516
  • Lastpage
    519
  • Abstract
    A new multi-user hybrid surface and bulk micromachining process on silicon-on-insulator (SOI) wafers is discussed. This 13-mask process consists of a doped polysilicon layer for electrical connection and non-critical structures and a single crystal silicon (SCS) layer for excellent optical and mechanical properties in the critical MEMS design. There are 7 masks for doping and etching of the SCS layer. The flexibility and versatility of this process allows for microsystems designs such as actuators, optical gratings, and dimples/anchors on the SCS layer. The MEMS devices fabricated and tested in this paper include thermal actuators, hinges, latches, optical switches, mirrors, and waveguides.
  • Keywords
    actuators; diffraction gratings; etching; micromachining; micromechanical devices; micromirrors; optical switches; silicon-on-insulator; 13-mask process; MEMS design; MEMS devices; SCS layer anchors; SCS layer dimples; bulk micromachining process; doped polysilicon layer; doping; etching; hinges; latches; microsystems designs; mirrors; multi user hybrid process platform; optical gratings; optical switches; silicon-on-insulator wafers; single crystal silicon layer; thermal actuators; waveguides; Actuators; Doping; Mechanical factors; Microelectromechanical devices; Micromachining; Micromechanical devices; Optical design; Optical surface waves; Optical waveguides; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-8732-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2005.1453980
  • Filename
    1453980