• DocumentCode
    437564
  • Title

    Agent-based dynamic scheduling for semiconductor wafer fab

  • Author

    Li, Li ; Qiao, Fei ; Wu, Qidi

  • Author_Institution
    Sch. of Electron. & Inf. Eng., Tongji Univ., Shanghai, China
  • fYear
    2005
  • fDate
    19-22 March 2005
  • Firstpage
    163
  • Lastpage
    168
  • Abstract
    Semiconductor wafer fab is considered as the third kind of production system, differentiated with job shop and flow shop. It has its own scheduling and control characteristics, such as re-entrance, large-scale, mix processing model and unbalanced production facilities. To solve scheduling problem of semiconductor wafer fab, an agent-based scheduling approach for semiconductor wafer fab is proposed. Firstly, an agent-based scheduling model, which integrates release control, dispatching and machine maintenance scheduling, is presented. Secondly, negotiation protocol between agents, extended contract net protocol (ECNP), is given. Thirdly, scheduling algorithms for decision making of agents are offered. Finally, a simple model, but with essential characters of semiconductor wafer fabrication, is used to demonstrate how to use the proposed agent-based scheduling approach.
  • Keywords
    dynamic scheduling; flow shop scheduling; job shop scheduling; multi-agent systems; semiconductor device manufacture; agent-based dynamic scheduling; extended contract net protocol; flow shop scheduling; job shop scheduling; semiconductor wafer fabrication; Contracts; Dispatching; Dynamic scheduling; Flow production systems; Job production systems; Job shop scheduling; Large-scale systems; Production facilities; Protocols; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Networking, Sensing and Control, 2005. Proceedings. 2005 IEEE
  • Print_ISBN
    0-7803-8812-7
  • Type

    conf

  • DOI
    10.1109/ICNSC.2005.1461180
  • Filename
    1461180