DocumentCode
437564
Title
Agent-based dynamic scheduling for semiconductor wafer fab
Author
Li, Li ; Qiao, Fei ; Wu, Qidi
Author_Institution
Sch. of Electron. & Inf. Eng., Tongji Univ., Shanghai, China
fYear
2005
fDate
19-22 March 2005
Firstpage
163
Lastpage
168
Abstract
Semiconductor wafer fab is considered as the third kind of production system, differentiated with job shop and flow shop. It has its own scheduling and control characteristics, such as re-entrance, large-scale, mix processing model and unbalanced production facilities. To solve scheduling problem of semiconductor wafer fab, an agent-based scheduling approach for semiconductor wafer fab is proposed. Firstly, an agent-based scheduling model, which integrates release control, dispatching and machine maintenance scheduling, is presented. Secondly, negotiation protocol between agents, extended contract net protocol (ECNP), is given. Thirdly, scheduling algorithms for decision making of agents are offered. Finally, a simple model, but with essential characters of semiconductor wafer fabrication, is used to demonstrate how to use the proposed agent-based scheduling approach.
Keywords
dynamic scheduling; flow shop scheduling; job shop scheduling; multi-agent systems; semiconductor device manufacture; agent-based dynamic scheduling; extended contract net protocol; flow shop scheduling; job shop scheduling; semiconductor wafer fabrication; Contracts; Dispatching; Dynamic scheduling; Flow production systems; Job production systems; Job shop scheduling; Large-scale systems; Production facilities; Protocols; Semiconductor device modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Networking, Sensing and Control, 2005. Proceedings. 2005 IEEE
Print_ISBN
0-7803-8812-7
Type
conf
DOI
10.1109/ICNSC.2005.1461180
Filename
1461180
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