• DocumentCode
    437917
  • Title

    Building pixel detector modules in multi chip module deposited technology

  • Author

    Becks, K.-H. ; Flick, T. ; Grah, C. ; Gerlach, P. ; Mättig, P.

  • Author_Institution
    Dept. of Phys., Wuppertal Univ., Germany
  • Volume
    2
  • fYear
    2004
  • fDate
    16-22 Oct. 2004
  • Firstpage
    1241
  • Abstract
    The MCM-D technique has been used to build hybrid pixel detector modules and single chip assemblies with optimized sensor geometry. Results of test measurements in both a laboratory and a test beam environment are given.
  • Keywords
    multichip modules; position sensitive particle detectors; semiconductor diodes; silicon radiation detectors; ATLAS semiconductor detector; hybrid pixel detector modules; multichip module deposited technology; sensor geometry; silicon sensor diode; single chip assemblies; test beam; Active matrix technology; Bonding; Detectors; Flip chip; Geometry; Large Hadron Collider; Sensor systems; Testing; Thermal sensors; Thin film sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium Conference Record, 2004 IEEE
  • ISSN
    1082-3654
  • Print_ISBN
    0-7803-8700-7
  • Electronic_ISBN
    1082-3654
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2004.1462426
  • Filename
    1462426
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=437917