DocumentCode :
438375
Title :
Challenges to covering the high-level to silicon gap
Author :
Grundmann, Bill
Author_Institution :
Intel, Hillsboro, OR, USA
Volume :
1
fYear :
2005
fDate :
18-21 Jan. 2005
Abstract :
Silicon architects have a difficult task. They have to translate a high-level product desire into a lower-level description for silicon implementation. They are required to balance their own creativity, project schedule, solution cost, and the degree of difficultly of implementation. Microarchitectural design starts with a high-level premise. For microprocessors, this premise is in the form of an instruction set architectural (ISA) reference, which is usually in book form. The process of interpreting and converting this ISA, for example, into a constructible RTL requires experience, skills, sometimes arrogance and usually needs a lot of luck. Architectural exploration is heavily constrained by experiences and limited by lack of tools and project schedules. This task looks at the whole path from high-level to silicon, look at some of the research along that path and challenge everyone on the important need to cover the micro-architectural exploration gap.
Keywords :
elemental semiconductors; high level synthesis; instruction sets; integrated circuit design; microprocessor chips; silicon; RTL; architectural exploration; high level product; instruction set architectural reference; lower level description; microarchitectural design; microprocessors; silicon architects; silicon gap; Books; Circuit optimization; Costs; Delay; Instruction sets; Microprocessors; Performance analysis; Power dissipation; Processor scheduling; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
Print_ISBN :
0-7803-8736-8
Type :
conf
DOI :
10.1109/ASPDAC.2005.1466112
Filename :
1466112
Link To Document :
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