DocumentCode
438411
Title
Substrate resistance extraction with direct boundary element method
Author
Wang, Xiren ; Yu, Wenjian ; Wang, Zeyi
Author_Institution
Dept. Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
Volume
1
fYear
2005
fDate
18-21 Jan. 2005
Firstpage
208
Abstract
It is important to model the substrate coupling for mixed-signal circuit designs today. This paper presents the direct boundary element method (BEM) for substrate resistance calculation, where only the boundary of substrate region is discretized. Firstly, an efficient scheme for non-uniform element partition is proposed. Secondly, a new technique is presented which can reduce the scale of produced linear system and then accelerate the equation solving, especially for the multiple right-hand sides problem like substrate resistance extraction. Experiments show that the proposed method has shown high efficiency compared with existing methods while preserving high accuracy.
Keywords
boundary-elements methods; integrated circuit design; mixed analogue-digital integrated circuits; substrates; direct boundary element method; mixed signal circuit designs; nonuniform element partition; substrate coupling; substrate resistance extraction; Boundary element methods; Contact resistance; Electric potential; Geometry; Green´s function methods; Integral equations; Laplace equations; Linear systems; Matrices; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
Print_ISBN
0-7803-8736-8
Type
conf
DOI
10.1109/ASPDAC.2005.1466159
Filename
1466159
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