• DocumentCode
    438411
  • Title

    Substrate resistance extraction with direct boundary element method

  • Author

    Wang, Xiren ; Yu, Wenjian ; Wang, Zeyi

  • Author_Institution
    Dept. Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • Volume
    1
  • fYear
    2005
  • fDate
    18-21 Jan. 2005
  • Firstpage
    208
  • Abstract
    It is important to model the substrate coupling for mixed-signal circuit designs today. This paper presents the direct boundary element method (BEM) for substrate resistance calculation, where only the boundary of substrate region is discretized. Firstly, an efficient scheme for non-uniform element partition is proposed. Secondly, a new technique is presented which can reduce the scale of produced linear system and then accelerate the equation solving, especially for the multiple right-hand sides problem like substrate resistance extraction. Experiments show that the proposed method has shown high efficiency compared with existing methods while preserving high accuracy.
  • Keywords
    boundary-elements methods; integrated circuit design; mixed analogue-digital integrated circuits; substrates; direct boundary element method; mixed signal circuit designs; nonuniform element partition; substrate coupling; substrate resistance extraction; Boundary element methods; Contact resistance; Electric potential; Geometry; Green´s function methods; Integral equations; Laplace equations; Linear systems; Matrices; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
  • Print_ISBN
    0-7803-8736-8
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2005.1466159
  • Filename
    1466159