Application of Vias as Functional Elements in Microwave Coupling Structures

Author

Hardock, Andreas ; Rimolo-Donadio, Renato ; Bruns, Heinz-Dietrich ; Schuster, Christian

Author_Institution

Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg (TUHH), Hamburg, Germany

Volume

61

Issue

10

fYear

2013

fDate

Oct. 2013

Firstpage

3541

Lastpage

3550

Abstract

A novel application of vertical interconnects (vias) in multilayer structures, such as printed circuit boards (PCBs), is presented. By carefully designing the electromagnetic via environment, it is shown that a pair of signal vias can be used as a building block for microwave couplers. Due to the inductive nature of the coupling, the coupled port is the far end. Coupling of -0.1 dB and directivities beyond 20 dB in the frequency range from 10 to 20 GHz can be achieved. The coupling mechanisms in PCBs are investigated for different electromagnetic environments and the influence of the geometrical and material parameters on the coupler performance is explored. Results are validated by full-wave simulations and S-parameter measurements.

Keywords

S-parameters; couplings; integrated circuit design; integrated circuit interconnections; microwave integrated circuits; multilayers; printed circuit design; vias; PCB mechanisms; S-parameter measurements; electromagnetic via environment; frequency 10 GHz to 20 GHz; full-wave simulations; geometrical parameters; material parameters; microwave couplers; microwave coupling structures; multilayer structures; signal vias; vertical interconnects; Cavity resonators; Couplers; Couplings; Impedance; Microwave circuits; Resonant frequency; Forward couplers; functional via; inductive coupling; microwave components; via coupler;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2013.2280112

Filename

6595157